Empowering the semiconductor industry with Autonomous AI Engineering Teams to compress tape-out cycles and redefine PPA boundaries.
To become the world's standard AI-native Silicon-as-a-Service layer, lowering engineering barriers for complex SoC and ASIC deployments.
From ultra-low-power IoT sensors to data-center-grade autonomous AI — two complete silicon platform families spanning 2nm to 28nm, designed at the frontier where the universe of intelligence meets silicon.
| Technology Node | 2nm / 3nm / 5nm |
| Transistors | 10B ~ 200B+ |
| CPU | Up to 16× Arm Cortex-A78AE @ 3.2GHz |
| NPU (INT8) | Up to 1000+ TOPS |
| NPU (INT4) | Up to 250+ TOPS |
| Memory BW | Up to 1 TB/s (LPDDR5X + HBM) |
| On-Chip SRAM | Up to 144MB |
| AI SRAM | Up to 128MB (Multi-Bank) |
| Process Voltage | 2nm: 0.6V–0.9V · 3nm: 0.6V–1.0V · 5nm: 0.7V–1.1V |
| Package | Advanced 2.5D / 3D · Chiplet / FOWLP / FCBGA |
| Power | 5W ~ 150W (Configurable) |
| Temp Range | -40°C ~ 125°C (Automotive Grade) |
| Safety | ISO 26262 ASIL-B / D Ready |
| Security | PSA Level 2 / Common Criteria EAL4+ |
ONNX Runtime · PyTorch · TensorFlow Lite · GGUF / LLM Runtime
LPDDR5X · HBM-lite / HBM2e · UCIe Ready · eMMC / UFS
PCIe Gen5/Gen4 · MIPI CSI/DSI · USB4/USB3.2 · Ethernet/TSN
Linux · RTOS · Android · Yocto · REST API · MQTT · OTA Update
| Tier | Target Use Case | CPU | NPU (TOPS) | Memory | Power | Process Node |
|---|---|---|---|---|---|---|
| Nano | Sensors / IoT | M0+ | 0.2 – 0.5 | 32 – 64MB | <100 mW | 22 / 28nm |
| Lite | Smart Camera | M33 | 0.5 – 1 | 128MB | <500 mW | 22 / 16nm |
| Pro | IPC / Vision AI | M33/M55 | 2 – 4 | 256MB | <1.5W | 12 / 16nm |
| Max | Edge AI Box | RISC-V / M7 | 8 – 16 | 512MB+ | <5W | 7 / 12nm |
| CPU | ARM Cortex-M33 / RISC-V RV32/64 |
| NPU | 0.2 ~ 16 TOPS (INT8 / INT16 / FP16) |
| Memory | LPDDR4/4X, DDR4, SRAM, Cache L1/L2 |
| Connectivity | Wi-Fi 4/5/6, BLE 5.x, Ethernet (opt.), USB 2.0 (opt.) |
| Video | MIPI CSI-2, ISP, JPEG, H.264/H.265, Compression |
| Security | Secure Boot, AES-256, SHA-2, TRNG, eFuse, OTA |
| Process Node | 22nm / 16nm / 12nm / 7nm (Scalable) |
| Package | BGA / WLCSP / SiP (configurable) |
| Temperature | −40°C ~ +105°C (Industrial Grade) |
| Deep Sleep | <150 µA (AON only) |
| Wake | <10 mA (Sensor trigger) |
| AI Active | 50–300 mA (NPU running) |
| Full System | 1–1.5W (AI + Wi-Fi TX Peak) |
A unified orchestration layer that dynamically plans, executes, and validates cross-domain workflows across all expert agent clusters.
Modeling · Model Optimization · Model Minimization · Software Hardening — the full-stack software technology layer that carries vision AI from trained model to hardened, production-grade inference on Edge AI & embedded vision systems.
Click "Run Agent Analysis" on each stage below to preview how our autonomous agent engines parse parameters, write code, and optimize architectures live.
Flexible operational frameworks engineered to match your team structure.
Every agent queries a shared, synchronized knowledge platform to preserve industry standards and lessons learned.
Share your target node, library stacks, and product timelines.
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